Item | Test Data | Test standard or Test method |
Thickness (Before Lamination, μm) | 16±10% | Enterprise Standard |
Thickness (After Lamination, μm) | 13±10% | Enterprise Standard |
Ground Resistance(Gold plated, φ 1.0mm, 1.0cm, Ω) | <1.0 | JIS C5016 1994-7.1 |
Peeling strength of reinforced film (N/25mm) | <0.3 | Enterprise Standard |
Lead-free Soldering Reflow (MAX 265℃) | No stratification; No foaming | JIS C6471 1995-9.3 |
Solder (288℃, 10s, 3 times) | No stratification; No foaming | JIS C6471 1995-9.3 |
Shielding Properties(dB) | >50 | GB/T 30142-2013 |
Surface Resistance(mΩ/□) | <350 | Four Terminal Method |
Flame Retardant | VTM-0 | UL94 |
Printing Character | PASS | JIS K5600 |
Glossiness(60°, Gs) | <20 | GB9754-88 |
Chemical resistance(Acid,alkali and OSP) | PASS | JIS C6471 1995-9.2 |
Adhesion to Stiffener (N/cm) | >4 | IPC-TM-650 2.4.9 |
Item | Test Data | Test standard or Test method |
Thickness (After Lamination, μm) | 14-18 | Enterprise Standard |
Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
Surface Insulation | ≥200 | Enterprise Standard |
Adhesive Fastness(Hundred cells test) | No cell fall off | JIS C 6471 1995-8.1 |
Resistant to Alcohol Wipe | 50 Times no damage | Enterprise Standard |
Scratch Resistance | 5 times no Leakage of metal | Enterprise Standard |
Ground Resistance, (Gold plating, φ 1.0mm, 1.0cm, Ω) | ≤1.0 | JIS C5016 1994-7.1 |
Lead-free Soldering Reflow (MAX 265℃) | No stratification; No foaming | JIS C6471 1995-9.3 |
Solder (288℃, 10s, 3 times) | No stratification; No foaming | JIS C6471 1995-9.3 |
Printing Character | PASS | JIS K5600 |
Item | Test Data | Test standard or Test method |
Thickness (After Lamination, μm) | 13±10% | Enterprise Standard |
Shielding Properties(dB) | ≥50 | GB/T 30142-2013 |
Ground Resistance, (Gold plated, φ 1.0mm, 1.0cm, Ω) | ≤0.5 | JIS C5016 1994-7.1 |
Ground Resistance, (Gold plated, φ 1.0mm, 3.0cm, Ω) | 0.20 | JIS C5016 1994-7.1 |
Release force (N/cm) | <0.3 | Enterprise Standard |
Surface Insulation(mΩ) | ≥200 | Enterprise Standard |
Adhesive Fastness(Hundred cell test) | No cell fall off | JIS C 6471 1995-8.1 |
Lead-free Soldering Reflow (MAX 265℃) | No stratification; No foaming | JIS C6471 1995-9.3 |
Solder (288℃, 10s, 3 times) | No stratification; No foaming | JIS C6471 1995-9.3 |
Flame Retardant | VTM-0 | UL94 |
Printing Character | PASS | JIS K5600 |
Lamination Method | Lamination condition | Solidification condition | |||
Temperature(℃) | Pressure(kg) | Time (s) | Temperature (℃) | Time(min) | |
Quick- Lamination | LKES800/6000:180±10LKES1000:175±5 | 100-120 | 80-120 | 160±10 | 30-60 |